Synopsis
Kaynes Technology’s subsidiary Kaynes Semicon is set to launch its OSAT plant in Sanand, Gujarat on March 31, with senior leaders expected at the event. The Rs 3,307 crore project marks a key step in India’s semiconductor push, with 10 approved projects worth Rs 1.6 lakh crore moving towards execution.India’s semiconductor ambitions are entering a decisive execution phase.
As of late 2025-early 2026, 10 projects worth ₹1.6 lakh crore have been approved across six states: spanning fabs, OSAT/ATMP units, and specialty semiconductor facilities.
Here’s a project-by-project snapshot of progress:
Commercial production underway / imminent (2026 cohort)
1. Micron Technology (ATMP (Assembly, Testing, Marking, and Packaging)) – Sanand, Gujarat
Investment: $2.75 billion
Status: Commercial production started (Feb 2026)
Details: First large-scale semiconductor production facility in India; shipments already underway
2. Kaynes Technology (OSAT) – Sanand, Gujarat
Investment: ₹3,307 crore
Status: Inauguration on March 31; entering production phase
Details: Wire bond + substrate packaging; had already completed validation and early shipments
3. CG Power + Renesas + Stars Microelectronics – Sanand, Gujarat
Investment: ₹7,584 crore
Status: Expected to begin commercial production in 2026
Details: OSAT facility with strong global partnerships
4. Tata Electronics (Fab with PSMC) -- Dholera, Gujarat
Investment: ₹91,526 crore
Status: Under construction; production targeted post-2026 ramp-up
Details: India’s first full-scale semiconductor fab; 50,000 wafer starts/month planned
5. Tata Electronics (OSAT) – Assam
Investment: ₹27,120 crore
Status: Advanced construction; expected operational by 2026
Details: High-volume packaging unit; key to Northeast’s entry into semiconductor map
Mid-stage projects (construction / early development)
6. HCL + Foxconn – Uttar Pradesh
Investment: ₹3,706 crore
Status: Project development stage; the project, had its groundbreaking ceremony in February 2026
Focus: Display driver ICs; wafer + packaging integration
7. 3D Glass Solutions (Advanced packaging) – Odisha
Investment: ₹1,943 crore
Status: Early execution phase
Focus: RF, SiP, glass interposers, heterogeneous integration
8. SiCSem (SiC fab + packaging) – Odisha
Investment: ₹2,066 crore
Status: Under development; SiCSem held the groundbreaking ceremony for its Silicon Carbide (SiC) semiconductor fabrication plant on November 1, 2025, at Info Valley, Bhubaneswar, Odisha.
Focus: Silicon carbide (SiC) fab + packaging; critical for EV/power electronics
Smaller / expansion projects
9. Continental Device India (CDIL) – Punjab (Expansion)
Investment: ₹117 crore
Status: Expansion underway; prior to this 2025 announcement, CDIL inaugurated a new surface mount packaging line in September 2023 and launched India's first indigenous Solar Bypass Diodes in February 2025.
Focus: Discrete semiconductors (MOSFETs, IGBTs, SiC devices)
10. ASIP Technologies (Advanced System in Package Technologies) is a semiconductor company establishing an OSAT and ATMP facility.
Joint Venture: Partnered with South Korean semiconductor firm APACT Limited to build a high-tech facility in Vizag.
Investment: The project involves an estimated investment of ₹890 crore.
Capabilities: Focused on advanced packaging, including 2.5D and 3D packaging, bumping lines (8” and 12”), and multi-chip modules (MCM).
Status: Groundbreaking ceremony in April 2026
Context: Four projects approved in Aug 2025 took total to 10
- 4 projects (Micron, Kaynes, CG Power, Tata) are expected to enter production in 2026
- India is transitioning from policy to production, with Sanand emerging as the first semiconductor cluster
- ISM 1.0 focused on fabs + ATMP/OSAT, while ISM 2.0 will expand into supply chain and materials
Why Kaynes matters in this timeline
Kaynes’ March 31 inauguration is significant because:
- It becomes India’s second OSAT/ATMP unit moving into production after Micron
- Marks entry of an Indian-origin EMS player into semiconductor manufacturing
- Helps build domestic packaging capacity, a key gap in India’s chip ecosystem
